Gyro - The Leader in Smart Semiconductor and Lights-Out Factory Efficiency Solutions

High-capacity and highly fixed logistics transportation systems, often benchmarked against OHTs in high-tech factories, offer extreme efficiency but come at a steep cost. However, they increasingly fall short in meeting the demands of flexible manufacturing, rapid deployment, and human-robot collaboration.

Magnetic-guided AGVs serve as a low-cost alternative, yet the installation of magnetic tracks and system planning are highly complex. Maintaining these tracks and modifying routes are challenging, making them unsuitable as a flexible and rapidly deployable transportation support system.

In recent years, trackless SLAM navigation robots have emerged as a leading next-generation transportation method. However, this technology is still maturing. Most system integrators (SIs) tend to adopt foreign robotic solutions, which often fail to meet diverse customer requirements in design. The resulting high costs and complex, inefficient software architectures have hindered widespread adoption.

Fortunately, Gyro has brought together numerous hardware, software, and robotics design experts with extensive field experience. By integrating existing IoT R&D resources, we have developed unique features distinct from other suppliers’ products, offering flexible logistics transportation solutions at reasonable prices.

Since its establishment in 2015, Gyro has been dedicated to developing high-end autonomous guided vehicles (AGVs) and robotic arm AGVs, focusing on the semiconductor and high-value smart factory sectors.

Gyro AMR is a standardized mobile robot based on laser SLAM navigation. It integrates omnidirectional wheels, AI navigation and positioning modules, a six-axis collaborative robotic arm, and flexible, high-efficiency dispatch software. This enables precise docking between AMRs and semiconductor production equipment, as well as accurate loading and unloading of materials. The product supports handling various sizes and types of materials, such as Tray trays, 8-inch wafer cassettes, 12-inch wafer FOUPs, Metal cassettes, and substrates magazines.

• High-precision omnidirectional wheels enable fast response and lateral movement at any angle, facilitating easy docking with equipment.
• AMR Alignment accuracy: 10 mm
• Robotic arm alignment accuracy: 0.1–1 mm
• Capable of resolving challenges such as multi-vehicle coordination, narrow aisles, complex paths, precise positioning, and rapid response.
• Meets industrial safety, reliability, and precision requirements.
• Comprehensive product certifications (SEMI-S2 certified, PMC certified - TSMC approved).

Equipped with TM Robotics’ six-axis collaborative robotic arm, it adapts to various complex and demanding operational environments. It delivers significant value by reducing manual labor, improving production efficiency, enhancing information transparency, and minimizing machine error rates.

Through three years of market validation (2018–2020) with leading packaging and testing giants such as ASE, PTI, and SPIL, Gyro has established that autonomous vehicles + electronic shelves + stockers + equipment retrofitting + IoT technology are essential standards for smart factories and lights-out factories.

Jetscrew System Gyrobot Intelligent Factory Total Solution

From 2018 to 2020, Gyro successfully obtained certifications from major semiconductor packaging and testing companies—ASE, Powertech Technology (PTI), and Siliconware Precision Industries (SPIL)—and secured orders, all of which have been officially delivered and deployed.

Recently, Gyro supported the world’s first 5G millimeter-wave smart factory by providing AMR-based unmanned handling system solutions. This 5G smart factory, jointly built by Chunghwa Telecom (CHT), ASE Technology Holding, and Qualcomm in Kaohsiung, southern Taiwan, is Taiwan’s first smart factory based on a designated 5G mmWave enterprise network.

The implementation has automated the upgrading and transformation of semiconductor workshops, enabling automated loading and unloading of equipment and material transfer between process machines. It addresses issues such as untimely manual loading, incorrect material handling, and difficulties in information tracking.